Filled vias are exported in a separate drill file and marked as IPC-4761 type VII (filled and capped) in the Gerber X2 output. BGA) and invoke the via filling command from the right click context menu. Simply drag a selection box around the area (e.g. Resin Filled Via Support (NCVF): There is now support for resin filled vias, typically used with via-in-pad.
This ensures that the uncoupled distance is minimised while also cornering in at 45 degrees, rather than at right angles. Either place and wire or designate existing pads/vias.ĭiff Pair Configurator: There is now an added differential pair configurator dialogue on the schematic to simplify the setup and make it easy to specify pass through components on the diff pair signal lines.ĭiff Pair Start point: Some extra work has been done on the routing algorithm for the automatic start of differential pair routing.Dedicated testpoint report and output plot.Use the live coverage monitor to work towards compliance of your testpoint strategy.Define clearances, board sides and other rules.Set minimum numbers on a net class basis.Dedicated support for testpoints throughout the software.
